Analyzing the detection method of radar level gauge

Radar level gauges are widely used in metallurgy, building materials, power, petrochemical, water conservancy, food and other industries. It is a high-tech product that uses microwave technology to check the material level. The material level meter uses microwaves to have good penetration and strong adaptability to harsh environments and measured materials. It uses the world's leading large-scale integrated circuits and uses radar Principles, digital signal processing skills and fast Fourier transform (FFT) skills. It adopts continuous jerk measurement, which can measure liquid and solid (block, powder) material level, and has the characteristics of long distance measurement and high precision. Radar Level Meter Viewing Methods: 1. Inquiry method Use vision, smell and touch. Sometimes, damaged components will change color, blister or burnt spots, burnt out components will produce some special smells, short-circuited chips will become hot, and weak soldering or desoldering can be found with the naked eye. . 2. Knocking method When it is found that the radar level gauge is running good and bad, most of this phenomenon is caused by poor contact or virtual welding. In this case, tapping and hand pressing can be used. The so-called 'knocking' is to gently hit the plug-in board or components with a small rubber hammer head or other knocking objects on the parts that may fail to see if it will cause errors or shutdown failures. The so-called 'hand pressure' means that when the fault occurs, after the power is turned off, the inserted parts, plugs and seats are pressed firmly by hand from the beginning, and then the power is turned on to try to see if the fault will be eliminated. If it is found that it is normal to hit the case once, but it is not normal to hit it again, it is best to reinsert all the connectors and try again. 3. Replacement method It is required to have two instruments of the same type or have enough spare parts. Replace a good spare with the same component on the faulty machine to see if the fault is eliminated. 4. Elimination method The so-called elimination method is a method to identify fault factors by plugging and inserting some plug-in boards and devices in the machine. When the surface returns to normal after a certain plug-in board or device is removed, it means that the fault occurred there. 5. Temperature rise and fall method Sometimes the surface works for a long time, or when the temperature of the working environment is high in summer, defects will appear. Turn off the machine and check it is normal, stop for a period of time and then turn it on again, and the defect will appear again after a while. This phenomenon is caused by the poor performance of a single IC or component, and the high temperature characteristic parameters cannot meet the target requirements. In order to find out the defect factors, the heating and cooling method can be used. The so-called cooling means that when a defect occurs, use cotton fiber to wipe anhydrous alcohol on the part that may have a defect to cool it down and check whether the defect is eliminated. The so-called temperature rise is to artificially increase the ambient temperature, such as putting an electric soldering iron close to suspicious parts (be careful not to raise the temperature too high to damage normal devices) to see if the defect appears. 6. Comparative method It is required to have two intelligent radar level gauges of the same type, and one of them is in normal operation. Using this method also has the necessary equipment, for example, multimeter, oscilloscope, etc. According to the nature of the comparison, there are voltage comparison, waveform comparison, static impedance comparison, output result comparison, current comparison, etc. The specific method is: let the surface with defects and the normal surface operate under the same conditions, then check the signals of some points and compare them with the two groups of signals measured. If there are differences, it can be determined that the defects are here. This approach requires the repairer to have the proper knowledge and skills. 7. Shoulder riding method The shoulder riding method is also called parallel method. Install a good IC chip on the chip to be checked, or connect good components (resistors, capacitors, diodes, triodes, etc.) Poor contact and other factors can be ruled out by using this method. 8. Isolation method Disadvantages The isolation method does not require the same type of equipment or spare parts for comparison, and is safe and reliable. Check the flowchart according to the defect, cut and enclose and gradually reduce the scope of defect search, and then cooperate with signal comparison, component exchange and other methods, and the location of the defect will usually be found quickly. 9. Capacitor bypass method When a strange phenomenon occurs in a certain circuit, such as the display is out of adjustment, the capacitor bypass method can be used to determine the part of the circuit that may be faulty. 10. Environment adjustment method Generally speaking, before the fault is determined, do not touch the components in the circuit at will, especially the adjustable devices, such as potentiometers. However, if a double-reference method is adopted in advance (for example, the position is marked or the voltage value or resistance value is measured before the touch is not touched), it is still allowed to touch if necessary. Perhaps after the change, sometimes the shortcomings will be eliminated. The power and ground terminals of the IC are connected across the base input terminal or collector output terminal of the transistor circuit to check the influence on the defect phenomenon. Assuming that the bypass input of the capacitor is ineffective and the defect disappears when its output is bypassed, it is judged that the defect is present in this stage of the circuit. Microwave solid flow meter Capacitive level meter Smart radar level meter

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